Test head utilized in a test system to perform automated at-speed testing of multiple gigabit per second high serial pin count devices

ABSTRACT

A portion of a test head utilized to perform simultaneous automated at-speed testing of a plurality of devices that generate serial data signals having gigabit per second baud rates. The portion of the test head includes connection sections that couple an external testing system to the portion of the test head, a restricted section positioned between said connection sections, a device interface board (DIB) having a device under test (DUT) holding section that secures the devices, said DIB positioned below said restriction section and a multi-layered rider board coupled to the devices via a coupling section, said rider board forming signal paths to route testing signals between at least the devices and the external testing system.

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims priority to U.S. Prov. App. No.60/371,673 filed Apr. 12, 2002, entitled “SYSTEMS AND METHODS FORAT-SPEED AUTOMATED TESTING OF INTEGRATED CIRCUITS,” which isincorporated by reference herein in its entirety.

[0002] This application is related to U.S. App. No. ______, entitled“SYSTEM FOR AT-SPEED AUTOMATED TESTING OF HIGH SERIAL PIN COUNT MULTIPLEGIGABIT PER SECOND DEVICES” (Atty. Doc. No. 1875,2380001); U.S. App. No.______, entitled “TEST SYSTEM RIDER BOARD UTILIZED FOR AUTOMATEDAT-SPEED TESTING OF HIGH SERIAL PIN COUNT MULTIPLE GIGABIT PER SECONDDEVICES” (Atty. Doc. No. 1875.2380002); and U.S. App. No. ______,entitled “METHODS USED TO SIMULTANEOUSLY PERFORM AUTOMATED AT-SPEEDTESTING OF MULTIPLE GIGABIT PER SECOND HIGH SERIAL PIN COUNT DEVICES”(Atty. Doc. No. 1875.2380003), all filed concurrently herewith, whichare all incorporated by reference herein in their entirety.

BACKGROUND OF THE INVENTION

[0003] 1. Field of the Invention

[0004] The present invention relates to automated testing systems andmethods that perform at-speed testing of high serial pin count devicesthat transmit serial data at gigabit per second baud rates.

[0005] 2. Related Art

[0006] Traditional testing systems for semiconductor devices employautomated testing equipment (ATE). Today, high-speed (e.g., gigabit persecond (Gbps) baud rate) semiconductors can be quad serial datainput/output (I/O) port (having 4 serial data pins per port coupled to 4transmit/receive differential pairs) stand-alone physical layer devices(PHY's) or high port count integrated application specific integratedcircuits (ASIC's), switches, or backplane transceivers. Most ATE'sbecome perpetually outdated in terms of being able to perform at-speedtesting (testing at the rated speed of the semiconductor device) of highspeed devices with high serial pin counts. Presently, two main ATE'sperforming tests on high speed high serial pin count devices are theTeradyne Tiger and the Agilent 93000 test platforms that can deliver1.25 Gbps on standard single ended channels, where Teradyne can deliver1.6 Gbps differential channels and Agilent can deliver 2.5 Gbpsdifferential channels. Aside from these ATEs, specialized high-speedtest options can cost hundreds of thousands of dollars and usually offervery limited functionality.

[0007] Aside from automated testing systems, non-automated testingequipment systems utilize “serial external loopback” (device transmitterconnected directly to device receiver) configurations for at-speedtesting (testing at the rated speed of the semiconductor device). Thereare also some single channel ATE instruments, such as digitizers andsine wave sources, as well as bench instrumentation with a few channelcapability, such as bit error rate testers (BERTs), that can be used totest some semiconductor devices. Unfortunately, these testing systemsare only effective for semiconductor devices with a very small number ofserial data pins and channels. This is because it can be difficult toroute many devices with a high number of serial data pins to a singleATE source or capture instrument due to limit device interface board(DIB) space allowed for application circuitry on test heads. Also, benchinstrumentation are an expensive upgrade solution to an ATE andtypically are not production worthy. Further, test time, whichcontributes to the cost of testing, is very high on benchinstrumentations because they are not designed for automated productiontesting.

[0008] To overcome some of these problems, other systems have utilized agolden device concept. In these systems a same or complementaryfunctioning semiconductor device as the device under test (DUT) is usedas a golden device to test itself. For example, when the speed of aserializer is too fast for an ATE then a deserializer can be used tobring down the speed into a range in which the ATE can test. However,the use of the golden device becomes non-trivial when the serial datapin and channel count of a DUT increases. This is because the testcomplexity is compounded by the need to have connections to the goldendevice, external loopback devices, and analog instrument device forsignal routing on one DIB, which makes the signal delivery or signalrouting too complex to design for high serial pin counts.

[0009] Consequently, a result of all these problems has been a dramaticdecrease in at-speed production test coverage. This has both lowered thequality of semiconductor devices and raised the rate of field defectsand failures.

[0010] Therefore, an ATE is needed that is capable of at-speed testingof multiple Gbps and higher semiconductor devices with high serial pincounts that can be easily adapted to keep up with the constantlychanging device speeds and configurations and that will be small enoughto fit in the limit real estate available on a DIB. There is also a needfor the ATE to have low capital costs for upgrades.

BRIEF SUMMARY OF THE INVENTION

[0011] Embodiments of the present invention provide a portion of a testhead utilized to perform simultaneous automated at-speed testing of aplurality of devices that generate serial data signals having multiplegigabit per second baud rates. The portion of the test head includesconnection sections that couple an external testing system to theportion of the test head, a restricted section positioned between saidconnection sections, a device interface board (DIB) having a deviceunder test (DUT) holding section that secures the devices, said DIBpositioned below said restriction section and a multi-layered riderboard coupled to the devices via a coupling section, said rider boardforming signal paths to route testing signals between at least thedevices and the external testing system.

[0012] An advantage of the embodiments of the present invention is thattesting devices having high serial pin counts (e.g., 72 channels coupledto 72 pins) has a low capital cost, usually less than $5000.00.

[0013] Another advantage of the embodiments of the present invention isthat the rider board has the ability to route DUT high-speed (e.g.,gigabit per second baud rate) serial signals with adequate signalintegrity to key test resources to obtain the highest level of testcoverage. Thus, a testing system can perform at-speed testing on 72channels, which accommodates even the highest integrated semiconductorsmanufactured to date. Also, there is no compromise on test coveragebecause the rider board also allows any serial pin to be routed to:other device pins for external loopback or snaking, BERT engines, ATEdigital pins, and ATE analog pins.

[0014] A still further advantage of the embodiments of the presentinvention is that the testing system is capable of at-speed or highspeed testing. This allows for at-speed testing of devices under testwith random data sequences and specification compliant data packets.Also, a BERT engine tests the devices in real time and does notsub-sample or under-sample. The rider board BERT channels are clock anddata recovery (CDR) based and are not reliant on phase or frequency ofDUT signals and timing.

[0015] A still further advantage of the embodiments of the presentinvention is that because the rider board is installed as a “daughterboard” to the DIB, the rider board does not interfere or require theremoval of any ATE pin electronics. This is in sharp contrast to theprior art that required the removal of ATE tester standard digital pinsfrom the ATE test system when installing new options in the ATE testers.That prior art systems and methods made the ATE test system lesseffective and not configured correctly for other high pin count devices.

[0016] A still further advantage of the embodiments of the presentinvention is that the rider board is easily and inexpensivelyupgradeable as the speed of tested devices increase. As an example,systems and methods according to embodiments of the present inventioncan test at least 5 Gbps and 6.25 Gbps devices.

[0017] A still further advantage of the embodiments of the presentinvention is that the rider board's RF connections to tester aregeneric, which means the rider board can be directly connected to anyATE instrument. In some embodiments, up to two differential ATEdigitizers or bench instruments and up to 5 differential pairs of ATEsources or bench instruments can be connected. Also, if a future ATEanalog instrument or a new bench instrument is required for testing aparticular device specification, the rider board inherently canaccommodate it.

[0018] Further embodiments, features, and advantages of the presentinventions, as well as the structure and operation of the variousembodiments of the present invention, are described in detail below withreference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS/FIGURES

[0019] The accompanying drawings, which are incorporated herein and forma part of the specification, illustrate the present invention and,together with the description, further serve to explain the principlesof the invention and to enable a person skilled in the pertinent art tomake and use the invention.

[0020]FIG. 1A shows an exemplary testing system according to embodimentsof the present invention.

[0021]FIG. 1B shows a more detailed view of the testing system in FIG.1A.

[0022]FIG. 1C shows connections between elements in the testing systemin FIGS. 1A-1B.

[0023]FIG. 2 shows device under test according to embodiments of thepresent invention.

[0024]FIG. 3 shows details of the testing system in FIGS. 1A-1C.

[0025]FIG. 4 shows an exemplary perspective view of a testing head froma first side in the system of in the preceding figures.

[0026]FIG. 5 shows an exemplary perspective view of a testing head froma second side with a cut-out portion showing a rider board coupled to aninside surface of the testing head in the system in the precedingfigures.

[0027]FIG. 6 shows an end view of exemplary connections between elementsin a testing system in the preceding figures.

[0028]FIG. 7 shows elements on an exemplary rider board according toembodiments of the present invention.

[0029]FIG. 8 shows a more detailed view of elements on a rider board inthe system in the preceding figures.

[0030]FIG. 9 shows a more detailed view of elements on a deviceinterface board in the system in the preceding figures.

[0031]FIG. 10 shows a more detailed view of elements on a rider board inthe system in the preceding figures.

[0032]FIG. 11 shows exemplary connections between elements on a riderboard in the system in the preceding figures.

[0033]FIG. 12 shows a more detailed view of a connection andmultiplexing system on a rider board in the system in the precedingfigures.

[0034]FIG. 13 shows a more detailed view of a section of a multiplexingsystem on a rider board in the system in the preceding figures.

[0035]FIG. 14 shows a more detailed view of a section of a multiplexingsystem on a rider board in the system in the preceding figures.

[0036]FIG. 16 shows exemplary connections between a tester, a test head,and a rider board in the system in the preceding figures.

[0037] FIGS. 16A-16B show exemplary connections between elements on arider board in the system in the preceding figures.

[0038]FIG. 17A pictorially illustrates an exemplary self loopback methodof testing a device under test (DUT) according to embodiments of thepresent invention.

[0039]FIG. 17B pictorially illustrates an exemplary full duplex adjacentcore loopback method in a first direction of a DUT according toembodiments of the present invention.

[0040]FIG. 17C pictorially illustrates an exemplary full duplex adjacentcore loopback method in a second direction of a DUT according toembodiments of the present invention.

[0041]FIG. 18A pictorially illustrates an exemplary internal snake downtesting method of a DUT according to embodiments of the presentinvention.

[0042]FIG. 18B illustrates a signal path through elements in the systemduring the internal snake down testing method of FIG. 18A.

[0043]FIG. 19A pictorially illustrates an exemplary internal snake uptesting method of a DUT according to embodiments of the presentinvention.

[0044]FIG. 19B illustrates a signal path through elements in the systemduring the internal snake up testing method of FIG. 19A.

[0045]FIG. 20 pictorially illustrates a flow path of a signal during anexemplary external snake down testing method of a DUT according toembodiments of the present invention.

[0046]FIG. 21 pictorially illustrates a flow path of a signal during anexemplary external snake up testing method of a DUT according toembodiments of the present invention.

[0047]FIG. 22A shows an exemplary bit error rate tester (BERT)configuration to perform BERT testing methods of a DUT according toembodiments of the present invention.

[0048]FIG. 22B shows an exemplary multiplexer configuration to performthe operation in FIG. 22A.

[0049]FIG. 23A shows an exemplary transmit analog testing systemconfiguration to perform analog testing methods of transmit pins of aDUT according to embodiments of the present invention.

[0050]FIG. 23B shows an exemplary receive analog testing systemconfiguration to perform analog testing methods of receive pins of a DUTaccording to embodiments of the present invention.

[0051]FIG. 24 illustrates a flow chart depicting a method according toembodiments of the present invention.

[0052]FIG. 25 illustrates a flow chart depicting a method occurringduring the method in FIG. 24.

[0053]FIG. 26 illustrates a flow chart depicting a method according toembodiments of the present invention.

[0054] The present invention will now be described with reference to theaccompanying drawings. In the drawings, like reference numbers indicateidentical or functionally similar elements. Additionally, the left-mostdigit(s) of a reference number identifies the drawing in which thereference number first appears.

DETAILED DESCRIPTION OF THE INVENTION

[0055] Overview of testing system and operation

[0056] According to embodiments of the present invention, an automatedtesting system 100 comprises a testing system (e.g., automated testequipment (ATE)) 102 coupled to a tested system 104, as shown in FIGS.1A-1C. The ATE 102 can be a Teradyne Tiger ATE or any other ATE nowdeveloped or developed in the future. The tested system 104 includes atest head 106 that includes a device interface board (DIB) 108 having adevice under test (DUT) holding device 110, which can be a socket orcontactor. The DIB 108 is coupled to a rider board 112 via a couplingsystem 114 (114A-114C). The rider board 112 can be essentially a“daughter” board that connects to a surface the DIB 108 opposite asurface with the DUT holding device 110 via board connectors 114C, whichmay be high-density parallel board connectors described in more detailbelow with reference to FIGS. 6 and 10. The ATE 102 includes analog 116and digital 118 signal stimulus and capture/measure devices.

[0057] It is to be appreciated that throughout the specification the useof “coupled” can mean electrically coupled, mechanically coupled, orboth depending on the situation so that signals can be routed throughthe system 100. Also, throughout the specification, the use of“internal” and “external” testing systems refer to whether the testingsystem is on rider board 112 (internal) or not on rider board 112(external).

[0058]FIG. 2 shows a device 200 secured by the DUT holding device 110according to embodiments of the present invention. The device 200 can bea transmitter-receiver (transceiver) device including a plurality oftransceivers 202(0-3). In some embodiments, device 200 can be aserializer-deserializer (SerDes) device, as will be described below.Device 200 can be constructed on a single IC substrate. As an example,transceiver 202(0) includes a serial data transmitter 204(0) and aserial data receiver 206(0). The transmitter 204(0) receives paralleldata 208 over a parallel bus (not shown). Transmitter 204(0) convertsparallel data 208 into a serial data signal 210 that travels throughchannels 222 (e.g., wires, microstrip, conductive material, etc). Thetransmitter 204(0) includes output pins 212A and 212B coupled tocorresponding ones of channels 222. Transmitter 204(0) transmits aserial data signal 210 as a differential serial data signal includingfirst and second differential data signals 210A and 210B (also referredto as digital data signal components 210A and 210B), which arecomplementary to each other. Transmitter 204(0) transmits serial datasignals 210A and 210B from respective pins 212A and 212B throughrespective channels 222. Data signals 210A and 210B (signal 210) havebaud rates in the multi-gigabit per second range.

[0059] With continuing reference to FIG. 2, the receiver 206(0) includesinput pins 214A and 214B coupled to respective channels 222 forreceiving a differential serial data signal 216. Serial data signal 216includes first and second differential signals 216A and 216B, which havebaud rates in the multi-gigabit per second range. Receiver 206(0)converts the serial data signal 216 into a corresponding parallel datasignal 218, and transmits the parallel data signal over a parallel databus (not shown). The remaining transceivers 202(1-3) are configured andoperate in substantially the same manner as transceiver 202(0). Theserial input/output (VO) portion of each transceiver 202, which includesthe pins 212A-B and 214A-B, is referred to as a port 220.

[0060] In some embodiments, there are nine devices 200 with four ports220 per device. Thus, there are 36 ports with 36 pairs of serialtransmit and receive differential signals 210 and 216, totaling 72differential signals 210 and 216, and 144 pins 212 and 214 having baudrates in the multi-Gbps range. Throughout the specification, the device200 is referred to interchangeably as a device or core and the port 220is referred to interchangeable as a port or a lane.

[0061] One example of a device 200 can be a SerDes Chip manufactured byBroadcom Corporation. This chip is further described in: U.S.provisional application titled, “High-Speed Serial Transceiver,” Ser.No. 60/200,813, filed Apr. 28, 2000; U.S. non-provisional patentapplication titled, “Timing Recovery and Frequency Tracking System andMethod,” Ser. No. 09/844,432, filed Apr. 30, 2001; U.S. non-provisionalpatent application titled, “Timing Recovery and Phase Tracking Systemand Method,” Ser. No. 09/844,296, filed Apr. 30, 2001; U.S.non-provisional patent application titled, “Methods and systems foradaptive receiver equalization,” Ser. No. 09/844,283, filed Apr. 30,2001; U.S. non-provisional patent application titled, “High-Speed SerialData Transceiver and Related Methods,” Ser. No. 09/844,441, filed Apr.30, 2001; and U.S. non-provisional patent application titled, “PhaseInterpolator Device and Method,” Ser. No. 09/844,266, filed Apr. 30,2001, all of which are incorporated herein by reference in theirentireties.

[0062] With continuing reference to FIGS. 1A-1C, 2, 3, and 7, the system100 is configured to allow the DUT holding device 110 to hold aplurality of high serial pin count devices 200. The system 100 routesserial data at high speeds (e.g., at gigabit per second baud rates). Thedevices 200 are coupled to each other and the ATE 102 in variousconnectivity configurations via a multiplexing system 302 and acontrolling system 306 on the rider board 112, described in more detailbelow. These systems on the rider board 112 allow for simultaneousfunctional, parametric, analog, and digital at-speed testing. At-speedtesting means that the testing is performed at the rated I/O speed ofthe semiconductor device 200. By performing simultaneous at-speedtesting, the testing time, and in turn the testing costs, are reduced1/x for x devices.

[0063] As seen in FIGS. 1C, 3, and 7 the rider board 112 is coupled tothe DIB 108 via the coupling system 114, which includes nine connectors114A on the DIB 108 and nine corresponding connectors 114B on the riderboard 112 that are coupled via connector 114C. In some embodiments, moreor less connectors can be provided based on the amount of devices 200being tested. Also, in some embodiments receptacle or female typeconnectors 114A can reside on the DIB 108 and plug or male typeconnectors 114B can reside on the rider board 112, or vice versa. Theconnectors 114A and 114B are coupled together via board connectors 114C,described in more detail below. Each connector 114B on the rider board112 is coupled to a core/connecting system multiplexer 308 inmultiplexing system 302. Throughout the specification, the multiplexingsystem 302 can be interchangeably referred to as a multiplexing system,a switching matrix, a switching fabric, or the like. When there aredevices 200 installed in holding device 110, the main core mulitplexer308 connects from each device 200 to: a transmit analog mulitplexer 310A(FIG. 10) in the multiplexing system 302, a receive analog multiplexer310B (FIG. 10) in the multiplexing system 302, and an internal testingsystem multiplexer 312 (FIG. 10) in the multiplexing system 302. Theinternal system multiplexer 312 is coupled to an internal testing system304, which can include bit error rate test engines (BERT engines). Insome embodiments, the multiplexing system 302 can be made up of 226 highbandwidth GaAs switches 1202 (FIG. 12) controlled by a controllingsystem 306 via over 600 control lines. The controlling system 306 caninclude two field programmable gate array (FPGA) controllers 808 (FIGS.8A, 10, 11, and 15).

[0064] Test Head

[0065]FIG. 4 illustrates a perspective view of a portion 400 facingoutward from the test head 106 according to embodiments of the presentinvention. The portion 400 of the test head 106 includes the DIB 108with the DUT holding device 110 and DIB connectors 904 (FIG. 9), whichare part of the DIB connecting system 114A. Also, the portion 400includes a restricted section 404 and a coupling or connection section406, which couples the external testing system 102 to the test head 106.As was discussed above, the test head 106 generally has some areas thatcannot include any additional user or proprietary equipment or devices.The restricted section 404 is located in these areas. This, along withthe coupling or connection section 406, substantially reduces theavailable space on the test head 106 for the DIB 108. This has in priorart systems limited the space available to couple more than a two DUTsbecause of the amount of space needed for their respective connectionwiring. Thus, according to embodiments of the present invention, inorder to test a plurality of devices 200, such a nine devices,connections between different ones of the devices 200 are provided bythe multiplexing system 302 and control system 306 on the rider board112, as will be described in more detail below.

[0066]FIG. 5 illustrates a perspective view with a cut-away sectionshowing a portion 500 facing inward from the test head 106 according toembodiments of the present invention. The portion 500, which is coupledon a surface of the test head 106 opposite a surface with the DUTholding device 110, is substantially made up of the rider board 112. Thedashed square 502 on the portion 500 is where the DUT holding device 110resides on the DIB 108. The portion 500 includes connectors 804 (FIG.8), which are part of the rider board connecting system 114B. Theconnectors 804 correlate with and are coupled to the connectors 904 viaconnectors 114C. The portion 500 also includes controllers 808 (FIG. 8),which are part of the controlling system 306, and testers 810 (FIG. 8),which are part of the internal testing system 304.

[0067]FIG. 6 illustrates an end view of a portion of the system 100according to embodiments of the present invention. As can be seen, a DUT600 is coupled to the DUT holding device 110 on the DIB 108. Also, theDIB connecting system 114A (not shown in this figure) are coupled viaconnectors 602, which are part of the connector 114C, to the rider boardconnectors 114B (not shown in this figure). The connector 114C can be aTeradyne connection system called “NexLev” that is rated to carrysignals at to over 3.2 Gbps with a density of 145 signals per inch. Forexample, if the DUT 600 includes nine cores 200 there would be nineconnectors 602 (one for each core), which would provide 100 signal pinsand 90 grounds per connector, or a total capacity of 900 signals.

[0068] Accordingly, in order to accommodate nine devices 200, the riderboard 112 is utilized to move all signal switching/multiplexingfunctions 302 and the internal testing system 304 off of the DIB 108.Hence, the necessary real estate needed on the DIB 108 for the DUTholding device 110 that can hold a plurality of cores 200, for examplenine cores 200 with 36 transmit and receive differential serial pairs,remains.

[0069] Rider Board and DIB

[0070] As seen in FIG. 8, the rider board 112 according to embodimentsof the present invention includes multiple connecting sections 800. Eachof the connecting sections 800 includes hundreds or thousands ofconnecting devices (not shown), which can be copper strips, wires, fiberoptics, or the like. The connecting devices couple all the components inthe system 100 together in various configurations to route a testingsignal through the system 100 in order to perform the various automatedtesting operations described below. In one embodiment, there are twentyconnecting sections 800. Most of the components of the rider board 112are located on a top section 802 of the connecting sections. The topsection 802 includes connector/multiplexer devices 804 (labeled C/M-0through C/M-8). The C/M devices 804 are comprised of the connectors 114Band a set of multiplexers in the multiplexing system 302. Although nineC/M devices 804 are shown, it is to be appreciated there may be more ofless based on the amount of cores 200 being tested. The rider board 112further includes controllers 808 and testers 810. The controllers 808can be field programmable gate array (FPGAs) in the controlling system306. The testers 810 can be BERT and/or PRBS (pseudo random bitsequence) engines in the testing system 304. The BERT engines 810 can belocated in SerDes devices (similar to devices 200) utilized in thetesting system 304, which allows for the at-speed testing of the cores200.

[0071]FIG. 9 shows an arrangement of components on the DIB 108 accordingto embodiments of the present invention. The DUT holding device 110includes nine cores 200 (labeled DUT-0 through DUT-8), a controller 900,and a switching system 902. Each of the cores 200 is coupled to acorresponding connector 904 (labeled C-0 through C-8). For example,nodes 212 and 214 of each core 200 are connected to a correspondingconnector C0-C8. As can be seen in FIGS. 8 and 9, the C/Ms 804 arelocated in the same position on rider board 112 as the connectors (Cs)904 on the DIB 108. C/Ms 804 and Cs 904 are connected via connectors 602(FIG. 6).

[0072]FIG. 10 is a block diagram showing more details of the elements onthe rider board 112 and the DIB 108 according to embodiments of thepresent invention. The multiplexing system 302 on the rider board 112 iscoupled to the nine cores 200 via the connecting device 602 thatconnects the Cs 904 on the DIB 108 to the C/Ms 200 on the rider board112. Signal paths associated with each of the nine cores 200 in the DUT600 are coupled (e.g., electrically) to each other and to the externaltesting system 102 in various signal paths based on signal pathsprovided through a main core multiplexer 308 to perform during varioustesting operations as described in more detail below.

[0073] For example, during analog testing operations, as described inmore detail below with reference to FIG. 23, the cores 200 in the DUT600 are coupled to an analog transmit testing system 116A in the analogtesting system 116 via the transmit analog multiplexer 310A and/or to ananalog receive testing system 116B in the analog testing system 116 viathe receive analog multiplexer 310B. In another example, during BERTtesting operations, as described in more detail below with respect toFIG. 22A, the cores 200 in the DUT 600 are coupled to one of two BERTengines 1010A and 1010B via BERT multiplexers 312A and 312B located inthe multiplexing system 302. Input and output (I/O) nodes in the analogtesting multiplexers 310 and the BERT multiplexers 312 are controlledvia the multiplexer controller 306 to form signal paths through themultiplexers 308, 310, and 312 and to take signals off-board. All of thecomponents on the rider board 112 are powered via a power managementsystem 1014.

[0074]FIG. 11 shows a portion of connections made between elements onthe rider board 112 according to embodiments of the present invention. Afirst set of C/Ms 804 (e.g., all but two C/Ms) can be coupled tocontroller 808-1 via control lines 1102 and a second set of C/Ms 804(e.g., the remaining ones not coupled to 808-1) and all othermultiplexers (e.g., multiplexers 310 and 312) on rider board 112 can becoupled to 808-2 via control lines 1102. As will be discussed in moredetail below, there are 16 multiplexers 1202 (FIG. 12) connected to eachcontroller 808, where each multiplexer 1202 receives 6 control linesthat carry control signals from the controller 808 to the C/M 804. Thus,each line 1102 entering a C/M 804 in FIG. 11 equates to 8×6=48 controllines. Hence, there are at least 48×9=432 total control lines betweenthe controllers 808 and the C/Ms 804 to control the routing of signals210 and 216 between the devices 200, the internal testing system 304,and the external testing system 102. Also, there are other control lines1102 to the other multiplexers (e.g., 310 and 312) that are controlledby controllers 808. In total, there can be over 800 control lines 1102.The controlling forms signal paths through the system 100, and morespecifically through the connecting devices (now shown) on the multiplelayers of connecting sections 800. In various embodiments, either one orboth of the controllers 808 can be connected to each of the C/Ms 804.Also in various embodiments, each of the C/Ms 804 is coupled to one ofthe testers 810, which can be through the BERT multiplexer 312 as shownin FIG. 10.

[0075] Rider Board Multiplexing/Switching System

[0076] Throughout the rest of the specification, the following protocolwill be used to describe the system 100 and operations performed by thesystem 100. TX# and RX#. This is meant to convey: T=transmitter andR=receiver; X=core number, and #=port number of the identified core. Forexample T00 is a transmitter in port 0 of core 0 and R21 is a receiverin port 1 of core 2. If only X is used, then no particular core is beingdiscussed, just the cores in general.

[0077] FIGS. 12-14 show a more detailed view of the C/M 804 according toembodiments of the present invention. Each of the C/Ms 804 include aconnector 1200 and switches or multiplexers 1202 that are located in themain core multiplexer 1004. The multiplexers 1202 can be high bandwidth1:6 multiplexers, i.e., multiplexers capable of passing signals havingfrequencies in the multi-gigabit per second range with littleattenuation. The number of multiplexers 1202 coupled to the connector1200 is based on the number of pins 212 and 214 associate with each core200. In the example being used throughout the specification, each core200 has four ports 220 with four pins 212A-B and 214A-B per port 220 fora total of 16 pins. Thus, the connector 1200 would need to be coupled to16 multiplexers 1202, one for each pin 212 and 214.

[0078]FIG. 13 illustrates a pair 1300 of multiplexers 1202(TX) and1202(RX) according to embodiments of the present invention. Signal pathsthrough the multiplexers 1202 are shown as dashed lines. If multiplexer1202(TX) is routing a signal 210 originating from pin 212(TX), thesignal 210 is input at node 1302 and can be selectively routed undercontrol of the controller 808 via control line 1303 carrying at leastsix control signals to one of six nodes: (1) a TX Core Loopback firstdirection node 1306; (2) a TX Core Loopback second direction node 1308,(3) a TX Analog node 1310; (4) a BERT multiplexer node 1312; (5) a highspeed digital (HSD) node 1314 (coupled to the digital testing system118); or (6) a RX node 1316. Multiplexer 1202(TX) routes a signal fromnode 1302 to a selected on of nodes 1306-1316 by connecting node 1302 tothe selected node.

[0079] With continuing reference to FIG. 13, similarly, if multiplexer1202(RX) is routing a signal 216 going to 214(RX), the signal 216 isoutput from node 1302 and can be selectively routed under control of thecontroller 808 via control line 1303 carrying at least six controlsignals. The signal 216 is input at one of six nodes: (1) a RX CoreLoopback first direction node 1318; (2) a RX Core Loopback seconddirection node 1320; (3) a RX Analog node 1322; (4) a BERT multiplexernode 1324, (5) a HSD node 1326; or (6) a TX node 1328. A more detaileddiscussion of the signal paths through the pair of multiplexers 1300during testing operations will be discussed below. It is to beappreciated, multiplexers do not have to be in pairs, but can be bythemselves.

[0080]FIG. 14 shows one embodiment of an arrangement of the multiplexerpairs 1300. In this figure, the pairs 1300 are arranged corresponding toa device 200 having 4 ports/lanes 220 with differential transmit 212 andreceive 214 pins.

[0081]FIG. 15 shows connections between components in a portion of thesystem 100 according to embodiments of the present invention. Thus, ifcore 200(5) on DIB 108 is designated to transmit a signal 210, thesignal 210 leaving from the core 200(5) along the channels 222(T50)travels to a corresponding DIB connector 904(C5), through connector602(5), to corresponding rider board connector 1200(C5), to the node1302 on multiplexer 1202(T50). Then, the controller 808 sends a controlsignal to the multiplexer 1202(T50) to select the node (e.g., 1306-1316)through which the signal 210 will be routed. In a similar fashion, whenthe core 200(5) is designated to receive signal 216, signal 216 willenter the multiplexer 1202(R50) from one of the nodes (e.g. 1318-1328)and be routed under control of the controller 808 out node 1304. Thesignal 216 then travels through the connectors 1200(C5), 602(5), and904(C5) to the pin 214A(R50) or 214B(R50) of core 200(5).

[0082] FIGS. 16A-16B, which are unlabeled for convenience, are schematicdiagrams showing the connections on the rider board between multiplexers1202, 1004, 1006, and 312 for cores 200(0)-200(2). This figure onlyshows the TX+ and RX+ multiplexers 1202 corresponding to TX+ and RX+pins 212A and 212B and 214A and 214B of the cores 200(0)-200(2). As willbe described in more detail below regarding the operation of system 100,various automated testing operations are performed on the cores 200based on the connections and signal paths formed between themultiplexers 1202, 1006/1008, and 1012.

[0083] The rider board 112 accomplishes routing of serial data signalshaving Gbps baud rates in some embodiments with high bandwidth switches1202 (e.g., GaAs switches) implemented as various stages of multiplexersin the multiplexing system 302. This arrangement allows for complete(e.g., end-to-end) routing of serial data signals from the DUT 600 toall necessary resources. The routing allows for many instances ofparallel testing operations (e.g., simultaneous core loop back, snaking,BERT, etc.), as well as the ability to route any DUT serial data signalto an external testing system 102 resource. Radio frequency (RF) cablesfrom the external testing system 102, which are for carrying signals,are directly coupled to the rider board 112. Full connectivity allowsfor at least the following testing operations: differential signalconnectivity to BERT/PRBS engines 1010, differential signal connectivityto analog instruments 116, differential connectivity to external testingsystem devices 102, self core loopback, adjacent core loopback, andsnaking configurations.

[0084] The ability to perform simultaneous or parallel testing ofmultiple cores 200, which can be integrated and/or fabricated on onesemiconductor, greatly reduces test time and the cost of testing. Also,because the rider board 112 provides high bandwidth signal paths to theanalog testing system 116, as the external testing system 102 graduallyintroduces higher and higher bandwidth instrumentation, the DUT 600 canimmediately make use of the external testing system improvements via therider board 112.

[0085] As discussed above, in some embodiments of the rider board 112the internal testing system 304 can include one or more SerDes chips orother silicon technology manufactured by Broadcom Corporation as thesource for at-speed digital functional testing and BERT testing. Theseembodiments can make use of Broadcom's design-for-test (DFT) approach tomanufacturing chips that have integrated BERT and PRBS generatorscomplete with on-chip memory and programmable transmit amplitudes.Therefore, by using Broadcom semiconductors in these embodiments, theneed for focused external testing system instruments or BERT/PRBS benchinstrumentation is substantially reduced. Also, the rider board 112allows for rapid upgrades with silicon speed improvements with a simpleboard re-design for new semiconductor device(s). In the embodimentsusing Broadcom semiconductors on the rider board 112, the semiconductorscan be programmed via industry standard Managed Data Interface (MDI—IEEE802.3 clause 22 and 45), which allows rapid programming to alleviate theneed for slow external general purpose interface bus (GPIB) interface toBERT/PRBS bench instrumentation.

[0086] Automated At-Speed Self Testing Operations

[0087] Throughout the rest of the figures, external arrows between cores200 or between ports 220 of a core 200 represent a signal pathtraversing the multiplexer system 302 on the rider board 112 orestablished through the multiplexer system 302 on the rider board 112.This routing is illustrated in detail in FIGS. 18B, 19B, 22, and 23.Arrows shown inside the cores 200 represent internal looping eitherwithin the core 200 or through the DUT socket circuitry. In FIGS.17A-17C, 18A-18B, 22A-22B, and 23B, signals that appear to be generatedfrom a core 200 can be generated by a signal source (e.g., a BERTengine) in that core 200. Other signals can be generated, as shown, fromsources outside cores 200. Although not shown, a device and/or apparatuscan be coupled to the individual cores 200 or to tested system 104 togather the data accumulated during the testing to evaluate theperformance of the DUTs 110.

[0088] FIGS. 17A-17C, 18A-18B, and 19A-19B illustrate automated selftesting operations in the system 100 according to embodiments of thepresent invention. Throughout the description of the operations ofsystem 100 it is to be appreciated that, although not always described,every signal can be a serial data signal 210 and can be routed throughsignal paths formed through the multiplexers 1202 based on controlsignals from the controller 808. The control signal determines whichoutput node on the multiplexer 1202 an input signal 210 is output. It isto be appreciated that almost all the automated testing operationsinvolve full duplex serial data signal transmission. That means that allthe pins 212 and 214 are transmitting and receiving serial data signals210 and 216 at the same time. Thus, in our example of having nine cores200 with four ports 220 per core 200 and four channels 222 (or four pins212 and 214) per port 220, 144 serial data signals 210 and 216 arerouted by a core 200 to an adjacent core 200 at the same time.

[0089]FIG. 17A shows an automated self loopback method 1700 according toembodiments of the present invention. During this operation 1700, serialdata signals 210 generated in the core 200 are routed through themultiplexers 1202 corresponding to that core 200 and back to that core200. For example, serial data signals 210 transmitted from the core200(X) are received at node 1302 of the corresponding transmitmultiplexer 1202(TX) and routed to and output from node 1316. The serialdata signals 210/216 are then received at node 1328 of the receivemultiplexer 1202(RX) and routed to and output from node 1304. The serialdata signals 216 then travel back to the same core 200(X). Similarly,all the other cores 200(1-8) and their corresponding multiplexer can berouting serial data signals.

[0090]FIG. 17B shows an automated full duplex adjacent core loopbackmethod 1710 in a first “direction,” where a direction can be a groupingof adjacent cores 200. The first direction configures cores 200 asfollows: 0-1, 2-3, 4-5, and 6-7, where core 8 is not involved. Duringthis operation, serial data signals 210 output from all the pins 212A-Bin a first core 200 are routed through the multiplexers 1202 to asecond, adjacent core 200, while serial data signals 210 output from allthe pins 212A-B in the second core 200 are sent from the second core 200and routed through the multiplexers 1202 to the first core 200. Forexample, serial data signals 210 generated from core 200(0) are receivedat nodes 1302 on corresponding transmit multiplexer 1202(T0) and routedto and output from nodes 1306. The signals 210/216 are then received atnodes 1318 in the multiplexers 1202(R1) and routed to and output fromnodes 1304 to core 200(1). Also, core 200(1) simultaneously sends serialdata signals 210 to core 200(0) based on the same functionality of thesystem 100. Further, all the other core pairs, 2-3, 4-5, and 6-7, can besimultaneously routing serial data signals 210/216 between each otherthrough their corresponding multiplexers.

[0091]FIG. 17C shows an automated full duplex adjacent core loopbackmethod 1720 in a second direction. The second direction configures cores200 as follows: 1-2, 3-4, 5-6, and 7-8, where core 0 is not involved.During this operation, serial data signals 210 output from all the pins212A-B in a first core 200 are routed through the multiplexers 1202 to asecond, adjacent core 200, while serial data signals 210 output from allthe pins 212A-B in the second, adjacent core 200 are sent from thesecond core 200 and routed through the multiplexers 1202 to the firstcore 200. For example, serial data signals 210 generated from core200(1) received at nodes 1302 on corresponding transmit multiplexer1202(T1) and routed to and output from the nodes 1308. The signals210/126 are then received at nodes 1320 in the multiplexers 1202(R2) androuted to and output from nodes 1304 to core 200(2). Also, core 200(2)simultaneously sends serial data signals to core 200(1) based on thesame functionality of the system 100. Further, all the other pairs, 3-4,5-6, and 7-8, are simultaneously sending serial data signals 210/126between each other.

[0092] FIGS. 18A-B pictorially show an automated internal snake downtesting operation 1800 according to embodiments of the presentinvention. During this operation 1800 signals generated in core 200(0)are sequentially routed through all the cores 200 until they reach core200(8). In order to perform this operation 1800, both the adjacent coreloopback operations 1710 and 1720 are performed in alternating fashion.For example, operation 1710 is performed to send signals from core200(0) to core 200(1), then operation 1720 is performed to send signalsfrom core 200(1) to core 200(2), then operation 1710 is performed tosend signals from core 200(2) to core 200(3), and so on.

[0093] With continuing reference to FIG. 18B, the signal path for theoperation 1800 is shown. Only the first three stages are shown forconvenience. During a first stage, a signal generated in core 200(0) istransmitted from pin 212A(T00) to connector 904(C0), to connector1200(C0), to node 1302(T00), to node 1306(T00), to node 1318(R10), tonode 1304(R10), to connector 1200(C1), to connector 904(C1), and to pin214A(R10) in core 200(1). During a second stage, the signal is passedthrough the core 200(1) to be transmitted from pin 212A(T10), toconnector 904(C1), to connector 1200(C1), to node 1302(T10), to node1308(T10), to node 1320(R20), to node 1304 (R20), to connector 1200(C2),to connector 904(C2), and to pin 214A(R20) in core 200(2). During athird stage, the signal is passed through the core 200(2) to betransmitted from pin 212A(T20), to connector 904(C2), to connector1200(C2), to node 1302(T20), to node 1306(T20), to node 1318(R30), andso on. The subsequent stages follow a similar pattern for the signalpath.

[0094] FIGS. 19A-B pictorially show an automated internal snake-uptesting operation 1900 according to embodiments of the presentinvention. During this operation 1900 signals generated in core 200(8)are routed in reverse sequence through all the cores 200 until theyreach core 200(0). In order to perform this operation 1900, both theadjacent core loopback operations 1710 and 1720 are performed inalternating fashion. For example, operation 1720 is performed to sendsignals from core 200(8) to core 200(7), then operation 1710 isperformed to send signals from core 200(7) to core 200(6), thenoperation 1720 is performed to send signals from core 200(6) to core200(5), and so on.

[0095] With continuing reference to FIG. 19B, the signal path for theoperation 1900 is shown. Only the first three stages are shown forconvenience. During a first stage, a signal generated in core 200(8) istransmitted from pin 212A(T80) to connector 904(C8), to connector1200(C8), to node 1302(T80), to node 1308(T80), to node 1320(R70) tonode 1304(R70), to connector 1200(C7), to connector 904(C7), and to pin214A(R70) of core 200(7). During a second stage, the signal is passedthrough the core 200(7) to be transmitted from pin 212A(T70) toconnector 904(C7), to connector 1200(C7), to node 1302(T70), to node1306(T70), to node 1318(R60), to node 1304 (R60), to connector 1200(C6),to connector 904(C6), and to pin 214A(R60) in core 200(6). During athird stage, the signal is passed through the core 200(6) to betransmitted from pin 212A(T60) to connector 904(C6), to connector1200(C6), to node 1302(T60), to node 1308(T60), to node 1320(R50), andso on.

[0096] Thus, as can be seen through the description to FIGS. 17A-19B,the operations are based on a certain protocol. That protocol can besummarized as follows: (1) determine what core 200 a signal (e.g., afirst signal) will be transmitted from; (2) determine which core 200 asignal (e.g., a second signal) will be transmitted to; (3) determinewhich pin the signal will be transmitted from; and (4) generate at leastone control signal in the controller 808 that is transmitted to themultiplexers 1202 associated with the cores 200 and pins 212 and 214based on the determinations. This protocol follows through for almostall automated testing operations discussed above and below.

[0097] Automated At-Speed External System Testing Operations

[0098] In FIGS. 20-22B, automated full duplex at-speed (e.g., multiplegigabit per second baud rate) functional system testing methods andoperations are shown. These tests can involve using a test signal fromthe internal 304 testing systems in the signal path. Thus, test signalsmay not be generated from a core under test as was done in the automatedself testing operations described above. However, the general protocolstill applies, as do the signal paths as described above. Thus, a maindifference between the self testing and functional testing operations isthat signals will be input from, output to, or routed through internal304 testing system instead of directly between multiplexers 1202.Therefore, for convenience of discussion, only additional steps orsignal paths will be discussed and previous signal paths will bereferenced. Full duplex testing allows for testing using differentfrequencies (e.g., a core clock and a BERT engine clock), so there willbe asynchronous frequency offset between a near end and far end of thesystem.

[0099]FIG. 20 pictorially shows an exemplary automated external snakedown testing operation 2000, which is similar to the automated internalsnake down testing operation 1800. A main difference between operation2000 and operation 1800 is that instead of core 200(0) generating a testsignal, core 200(0) receives a test signal 2002 from the external tester304. After receiving the test signal at core 200(0), the systemutilizing rider board 112 routes the signal sequentially in an ascendingcore order to the other cores 200 using the signal path as describedabove with reference to FIGS. 18A-18B and the internal snake downoperation 1800. After passing through core 200(8), the signal is sentback to the internal testing system 304.

[0100]FIG. 21 pictorially shows an exemplary automated external snake uptesting operation 2100, which is similar to the automated internal snakeup testing operation 1900. A main difference between operation 2100 andoperation 1900 is that instead of core 200(8) generating a test signal,core 200(8) receives a test signal 2102 from the internal testing system304. After receiving the test signal at core 200(8), the system 100utilizing rider board 112 routes the signal sequentially in a descendingcore order to the other cores 200 using the signal path as describedabove with reference to FIGS. 19A-19B and the internal snake downoperation 1900. After passing through core 200(8), the signal is sentback to the internal testing system 304.

[0101]FIG. 22A pictorially shows an exemplary automated BERT testingoperation 2200 according to embodiments of the present invention. Thistesting operation 2200 is most similar to the self loopback method 1700shown in FIG. 17A. One different is that two signals are flowing throughthe system, one from a BERT engine in a core 200 and one from BERTengines on rider board 112, are utilized. Another difference is that thesignal received from a core 200 at node 1302 of the pair of multiplexers1300 is routed to and output from node 1312 to the BERT engine 1010A/Bvia the BERT multiplexer 1012A/B. After passing through the BERT engine1010A/B, the signal is received at node 1324 and routed to and outputthrough node 1304 back to the same core 200 from which it wastransmitted. Thus, the signal interacts with the internal testing system304 before being routed back to its initial core 200.

[0102] As seen in FIG. 22A, four cores 200(0-3) are coupled to the firstBERT engine 1010A through the first BERT multiplexer 1012A and fivecores 200(4-8) are coupled to the second BERT engine 1010B through thesecond BERT multiplexer 1012B. In alternative configurations, more orless BERT multiplexers 312 can be used, thus changing the number ofcores 200 coupled to a single the BERT engine 1010.

[0103] Automated Analog Testing Methods

[0104]FIG. 23A pictorially illustrates an automated analog transmittesting operation 2300 according to embodiments of the presentinvention. A signal generated by a core 200 is received at node 1302 ofthe pair of multiplexers 1300 and routed to and output from node 1310 toanalog transmit multiplexers 310 and then to an analog transmit testingsystem 116A in external testing system 102. As shown, cores200(0)-200(3) use analog system multiplexer 310A-1 and cores200(4)-200(8) use analog system multiplexer 310A-2. It is to beappreciated, the cores can be grouped in any manner, so long as themultiplexer 310A receiving the signal from four of cores 200 is a 16:1multiplexer and the multiplexer 310A receiving the signal from five ofcores 200 is a 20:1 multiplexer. Once received, the signals areprocessed in analog transmit testing system 116A by a digital processingdevice (e.g., a GigaDig device) and evaluated.

[0105] During an automated analog transmit testing operation, thetransmit multiplexers 1202A are controlled by controller 808 to routesignals received at node 1302 to node 1310 and then to the analogtransmit multiplexers 310A. In turn, the analog transmit multiplexers310A are controlled by controller 808 to route signals to the analogtransmit signal testing system 116A.

[0106]FIG. 23B pictorially illustrates an automated analog receivetesting operation 2350 according to embodiments of the presentinvention. During automated analog receive testing operation 2350signals are generated in analog testing system 116 and transmitted tocore 200 via signal paths established on rider board 112 by controllers808. There are several embodiments of signal generation. A firstembodiment includes signal generators 116B-1 (e.g., ATE source1, ports 1and 2) that route signals through analog receive multiplexers 310B-1 and310B-2 and through C/Ms 804 to be received at cores 200. A secondembodiment includes signal generators 116B-2 (e.g., ATE source2, ports 1and 2) that route signals through analog receive multiplexers 310B-1 and310B-2 and through C/Ms 804 to be received at cores 200. A thirdembodiment includes signal generator 116B-3 (e.g., ATE source3, ports 1and 2) that routes signals through analog receive multiplexer 310B-3 toanalog receive multiplexers 310B-1 and 310B-2 and through C/Ms 804 fromnode 1322 out node 1304 to be received at cores 200. Signal generators116B can be sine wave generators. In other embodiments, two or three ofthe signal generators 116B can be used to simultaneously or sequentiallyroute different types of signals (e.g., sine waves and jittermodulation) through the rider board 112 to the cores 200.

[0107] During an automated analog receive testing operation, the analogreceive signal testing system 116B generates a signal that is passed tothe analog receive multiplexers 1008, which are controlled by controller808 to route the signal to node 1322 of the receive multiplexers 1202.The receive multiplexers 1202 are controlled by controller 808 to routethe signal to node 1304 from which it is output the core 200 it camefrom.

[0108] Overall Methodology

[0109]FIG. 24 illustrates a flow chart depicting a method 2400 forperforming automated at-speed testing of devices (e.g., 200) accordingto embodiments of the present invention. At step 2402 multiplexercontrol signals are generated. At step 2404, various signal paths areformed between a set of multiplexers and the devices based on themultiplexer control signals. At step 2406, test signals having multiplegigabit per second (MGBPS) baud rates are routed through the signalpaths.

[0110]FIG. 25 illustrates a flowchart depicting a method 2500 occurringduring the generating multiplexer control signals step 2402. At step2502, first signals are generated indicating where the test signals arebeing transmitted from. At step 2504, second signals are generatedindicating where the test signals are being transmitted to. At step2506, the multiplexer control signals are generated from the first andsecond signals.

[0111]FIG. 26 illustrates a flowchart depicting a method for performingautomated at-speed testing of a device. At step 2602, a set ofmultiplexers that includes one multiplexer for each of pin on the deviceis coupled to a rider board. At step 2604, each pin of each multiplexerin the set of multiplexers is individually controlled. At step 2606,signal paths are formed through each of the multiplexers based on theindividually controlling step 2604.

CONCLUSION

[0112] While various embodiments of the present invention have beendescribed above, it should be understood that they have been presentedby way of example only, and not limitation. It will be apparent topersons skilled in the relevant art that various changes in form anddetail can be made therein without departing from the spirit and scopeof the invention. Thus, the breadth and scope of the present inventionshould not be limited by any of the above-described exemplaryembodiments, but should be defined only in accordance with the followingclaims and their equivalents.

What is claimed is:
 1. A portion of a test head utilized to performsimultaneous automated at-speed testing of a plurality of devices thatoperate at multiple gigabit per second baud rates, the portion of thetest head comprising: connection sections that couple an externaltesting system to the portion of the test head; a restricted sectionpositioned between said connection sections; a device interface board(DIB) having a device under test (DUT) holding section that secures thedevices, said DIB positioned below said restriction section; and amulti-layered rider board coupled to the devices via a coupling section,said rider board forming signal paths to route testing signals betweenat least the devices and the external testing system.
 2. The test headof claim 1, wherein said coupling section comprises DIB connectors onsaid DIB and corresponding multi-layered rider board connectors on saidrider board, wherein an amount of the DIB and multi-layered rider boardconnectors is based on an amount of the devices.
 3. The test head ofclaim 1, wherein said DIB connectors are coupled to said multi-layeredrider board connectors via a linking connecting device.
 4. The test headof claim 1, wherein the devices comprise 16 serial pin multiple gigabitper second transceivers.
 5. The test head of claim 1, wherein thedevices comprise transceivers with 8 differential pairs of serial datachannels coupled to 16 serial data pins.
 6. The test head of claim 1,wherein said multi-layered rider board comprises: a multiplexer coupledto said coupling section corresponding to each of the serial pins; and acontroller coupled to said multiplexer.
 7. The test head of claim 6,wherein each said multiplexer comprises one input node routing saidtesting signal to first through sixth output nodes based on saidcontroller.
 8. The test head of claim 7, wherein said controller sendindividual control signals to each of said first through sixth outputnodes of said multiplexer.
 9. The test head of claim 7, wherein: saidinput node is coupled to a corresponding one of the devices; said firstoutput node is an analog testing system node; said second output node isa first direction device loopback node testing system node; said thirdoutput node is a second direction device loopback testing system node;said fourth output node is a bit error rate testing system node; saidfifth output node is a digital testing system node; and said sixthoutput node is coupled to a corresponding node of a predetermined one ofsaid multiplexers.
 10. The test head of claim 6, wherein each saidmultiplexer comprises first through sixth input nodes routing said testsignal to one output node based on said controller.
 11. The test head ofclaim 10, wherein said controller send individual control signals toeach of said first through sixth input nodes of said multiplexer. 12.The test head of claim 10, wherein: said output node is coupled to acorresponding one of the devices; said first input node is an analogtesting system node; said second input node is a first direction deviceloopback node testing system node; said third input node is a seconddirection device loopback testing system node; said fourth input node isa bit error rate testing system node; said fifth input node is a digitaltesting system node; and said sixth input node is coupled to acorresponding node of a predetermined one of said multiplexers.
 13. Thetest head of claim 1, wherein said DUT holding section further comprisesa controlling section and a switching section coupled to the devices.14. The test head of claim 1, wherein said multi-layered rider boardcomprises a plurality of connection section having a plurality ofconnection devices to route said test signal between at least thedevices and the external testing system.
 15. A system comprising:connection sections; a restricted section positioned between saidconnection sections; a device interface board positioned below saidrestriction section that includes a device holding section coupled to adevice connection section; and a multi-layered rider board coupled tosaid device holding section, the multi-layered rider having a switchingmatrix coupled to a control section via a connection device section.